PRODUCTS
Oxygen Free Copper
Use the high purity electrolytic piese as raw material to keep continuous casting in the Vacuum Oxygen-free environment.
* Ensure the fluenct of Electroplating process.
* Fits the standards of Horizontal Electro-Plating.
* Ensure the fluenct of Electroplating process.
* Fits the standards of Horizontal Electro-Plating.
Technical Parameters
|
Copper(%) |
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|
Cu |
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|
≥99.90% |
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| Impurity(%) | ||||
| Ag | Fe | Pb | Ni | Zn |
| ≤0.0025% | ≤0.0025% | ≤0.002% | ≤0.003% | ≤0.002% |
Main model
| Size (inches) | Size (mm) | Model |
| φ3/10x1/2 | φ8x12 | CU100 |
| φ5/9x1 | φ16x25 | CU102 |
